? semiconductor components industries, llc, 2005 june, 2005 ? rev. 1 1 publication order number: NUF6402MN/d NUF6402MN 4 line emi filter with esd protection this device is a 4 line emi filter array for wireless applications. greater than ?30 db attenuation is obtained at frequencies from 800 mhz to 3.0 ghz. it also offers esd protection clamping transients from static discharges. esd protection is provided across all capacitors. features ? emi filtering and esd protection ? integration of 28 discrete components ? dfn package, 1.35 x 3.0 mm ? moisture sensitivity level 1 ? esd ratings: iec61000?4?2 (level 4) machine model = c human body model = 3b ? this is a pb?free device* benefits ? reduces emi/rfi emissions on a data line ? integrated solution offers cost and space savings in a dfn package ? excellent s21 characteristics with very low parasitic inductances ? integrated solution improves system reliability ? compatible footprint to bga or flip?chip package applications ? emi filtering and esd protection for data lines ? wireless phones ? pdas and handheld products ? digital camera ? lcd displays 4 3 2 1 (bottom view) 9 10 11 12 8 7 6 5 gnd *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 1 64 02 m dfn12 case 506ad device package shipping ? ordering information NUF6402MNt1g dfn12 (pb?free) 3000 / tape & ree l marking diagram http://onsemi.com 1 (top view) 12 2 cd cd 11 3 cd cd 10 4 cd cd 9 5 cd cd 8 6 7 1 12 ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specification s brochure, brd8011/d. 6402= specific device code m = month = pb?free package (note: microdot may be in either location)
NUF6402MN http://onsemi.com 2 maximum ratings (t j = 25 c unless otherwise noted) parameter symbol value unit esd discharge iec61000?4?2 contact discharge v pp 8.0 kv operating temperature range t op ?40 to 85 c storage temperature range t stg ?55 to 150 c maximum lead temperature for soldering purposes (1.8 in from case for 10 seconds) t l 260 c maximum ratings are those values beyond which device damage can occur. maximum ratings applied to the device are individual str ess limit values (not normal operating conditions) and are not valid simultaneously. if these limits are exceeded, device functional operation i s not implied, damage may occur and reliability may be affected. electrical characteristics (t j = 25 c unless otherwise noted) parameter symbol test conditions min typ max unit maximum reverse working voltage v rwm 5.0 v breakdown voltage v br i r = 1.0 ma 6.0 7.0 8.0 v leakage current i r v rwm = 3.0 v 0.1 1.0 a resistance r a i r = 20 ma 85 100 115 capacitance (notes 1 and 2) cd v r = 2.5 v, f = 1.0 mhz 17 20 pf cut?off frequency (note 3) f 3db above this frequency, appreciable attenuation occurs 95 mhz 1. measured at 25 c, v r = 2.5 v, f = 1.0 mhz. 2. total line capacitance is 2 times the diode capacitance (cd). 3. 50 source and 50 load termination.
NUF6402MN http://onsemi.com 3 ?45 ?40 ?35 ?30 ?25 ?20 ?15 ?10 ?5 0 1.e+06 1.e+07 1.e+08 1.e+09 1.e+1 0 frequency (hz) s21 (db) ?45 ?40 ?35 ?30 ?25 ?20 ?15 ?10 ?5 0 1.e+06 1.e+07 1.e+08 1.e+09 1.e+10 frequency (hz) s21 (db) reverse voltage (v) normalized capacitance 0 0.5 1 1.5 2 012345 90 92 94 96 98 100 102 104 106 108 110 ?40 ?20 0 20 40 60 8 0 temperature ( c) resistance ( ) figure 1. analog crosstalk curve figure 2. typical capacitance vs. reverse biased voltage (normalized capacitance, cd @ 2.5 v) figure 3. typical resistance over temperature figure 4. insertion loss characteristic
NUF6402MN http://onsemi.com 4 package dimensions notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeter. 3. dimension b applies to plated terminal and is measured between 0.25 and 0.30 mm from terminal. 4. coplanarity applies to the exposed pad as well as the terminals. 5. exposed pads connected to die flag. used as test contacts. dim min max millimeters a 0.80 1.00 a1 0.00 0.05 a3 0.20 ref b 0.18 0.30 d 3.00 bsc d2 2.10 2.30 e 1.35 bsc e2 0.20 0.40 e 0.50 bsc k 0.20 ??? l 0.20 0.40 0.15 c d e b a 2 x 2 x 12 x a a1 (a3) 0.15 c pin one reference 0.08 c 0.10 c c seating plane d2 e2 bottom view b e 12 x 0.10 b 0.05 a c c l 12 x k 12 x side view top view note 3 16 7 12 2 x note 5 exposed cu (a3) 0.2 x 0.25 mm exposed pad 2.352 0.093 mm inches scale 16:1 0.265 0.01 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 0.479 0.019 0.351 0.014 dfn12 3.0*1.35*0.85 case 506ad?01 issue f on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, r epresentation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2?9?1 kamimeguro, meguro?ku, tokyo, japan 153?0051 phone : 81?3?5773?3850 NUF6402MN/d literature fulfillment : literature distribution center for on semiconductor p.o. box 61312, phoenix, arizona 85082?1312 usa phone : 480?829?7710 or 800?344?3860 toll free usa/canada fax : 480?829?7709 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.
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